New RAM EDM Technology
Superior Surface Finishes At Higher Speeds

High Quality Surface Finish (HQSF) technology, available only in Makino’s S-Series of RAM EDMs, improves RAM EDM performance by up to 30% over other sinkers in similar applications. HQSF uses a powder additive that is mixed with the dielectric fluid to improve electrical conductivity for more consistent discharging and spark diffusion. This diffusion provides a smaller crater for a superior finish without a loss in metal removal rates.

The special additive, called µSC, is non-toxic and costs 90% less than oil-based or metallic additives. It last ten times longer than previous additives, and can be used for both roughing and finish machining, thereby eliminating the need for a second dielectric system. With this, unattended operation is made possible, greatly improving throughput while reducing costs and machining time.

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HQSF technology relies on more than just an advanced additive. That’s why the S-Series machines include special filtration systems, controller software and other enhancements.

HQSF combines micro-discharge pulse control and high response servo technology with the use of the µSC additive that is highly stable in the dielectric fluid. It provides numerous benefits over the traditional method of mixing silicon or chrome in the dielectric fluid to obtain fine surface finishes. This new method is expected to find application in many areas, including the machining of ribs and other hard-to-polish shapes.

By circulating the dielectric fluid in the work tank, there is no need to flush our cuts. The additive disperses evenly throughout the tank for the highest possible degree of precision. In fact, HQSF technology is so precise it can deliver a mirror finish without benchwork or polishing. Excellent side surface finishes are obtained with HQSF and narrow gaps facilitate high-accuracy machining for those manufacturing die casting tools. HQSF also increases surface integrity by 400%, while reducing microcracking by 300%, which leads to longer die life.

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Unlike ordinary dielectric fluid, there is no significant decline in machining performance, even during rough machining. As a result, there is no need to change dielectric fluid from roughing to finish machining. HQSF only requires the concentration of the µSC additive to be checked once a week.

Uniformly superior finishes are achieved through HQSF, which reduces or eliminates polishing for complicated molds of various sizes. Machining speed is also markedly faster than with conventional methods. In addition, the stability of the machining process reduces machining time variation, making it easier to set machining conditions.


Source: Competitive Mold Maker, Volume 4, Number 1